Source : Free On-Line Dictionary of Computing

Chip Scale Packaging
     
         (CSP) Surface Mount International attendees debated
        chip scale technologies as system manufacturers seek new
        levels of package miniaturisation for chip-on-board, flip chip
        and multichip modules.  Technical and marketing gurus
        furthered the technical debate by focussing on which chip
        scale packaging schemes would be the most cost-effective for
        future packages designated for high volume consumer
        applications.  Bare chip package supporters noted that
        mainstream circuitry is readily available in known good die
        (KGD) from a number of suppliers. Traditional ball grid array
        packages received strong support for current high volume and
        high density manufacturing needs. Chip scale packages (CSP)
        provide pre-speed-sorted,pre-tested and pre-packaged die
        without requiring specialized testing. CSP supporters improved
        their position with ChipScale's announcement that Motorola
        will license its Micro SMT packaging technology.
     
        ["Chip scale packaging gains at SMI. (Surface Mount
        International)", Bernard Levine, Electronic News (1991), Sept
        4, 1995 v41 n2081 p1(2)].
     
        [But what is it?]
     
        (1996-07-09)